MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888

MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888

Compare Qualcomm Snapdragon 888 vs MediaTek Dimensity 7050 specifications, performance, and features. Explore chipset differences and find the latest phones with Easy EMIs from Bajaj Finance.
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MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 - In summary

The MediaTek Dimensity 7050 focuses on efficient 5G performance, while Snapdragon 888 targets flagship-level processing and graphics. Snapdragon 888 leads in the cited benchmark results, while Dimensity 7050 offers strong efficiency and useful connectivity features.


  • Architecture: Dimensity 7050 uses a 6nm design with Cortex-A78 and Cortex-A55 cores. Snapdragon 888 uses a 5nm design with Cortex-X1, Cortex-A78, and Cortex-A55 cores.
  • CPU: Snapdragon 888 reaches 2.84GHz and has a dedicated Cortex-X1 prime core. Dimensity 7050 reaches 2.6GHz with two Cortex-A78 performance cores.
  • GPU: Dimensity 7050 uses Mali-G68 MC4. Snapdragon 888 uses Adreno 660 for demanding graphics and gaming.
  • AI/NPU: Dimensity 7050 uses MediaTek NPU 550. Snapdragon 888 integrates the Hexagon 780 AI engine.
  • Target segment/value proposition: Dimensity 7050 suits efficient mid-range 5G smartphones. Snapdragon 888 is designed for flagship-class performance, gaming, and demanding applications.

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MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 - Overview

MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 are octa-core 5G chipsets designed for smartphones with different performance and efficiency priorities. MediaTek processor phones with the Dimensity 7050 use a 6nm process with Cortex-A78 and Cortex-A55 cores, while Snapdragon processor phones with Snapdragon 888 use a 5nm process with Cortex-X1, Cortex-A78, and Cortex-A55 cores. Snapdragon 888 offers a higher-performance CPU and Adreno 660 GPU, while Dimensity 7050 focuses on power efficiency, 5G features, and balanced gaming performance.


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Technical specifications - MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888

MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 support 5G smartphones but target different performance segments. Dimensity 7050 focuses on balanced performance and efficiency, while Snapdragon 888 offers flagship-level CPU, GPU, AI, and multimedia capabilities.

General information

Both chipsets use octa-core CPU designs and support 5G networks. Dimensity 7050 uses a 6nm process, while Snapdragon 888 uses a 5nm process.

The different CPU architectures and fabrication processes reflect their target smartphone segments. Dimensity 7050 is positioned for mid-range 5G phones, while Snapdragon 888 targets flagship smartphones.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
Chipset brandMediaTekQualcomm
ModelDimensity 7050Snapdragon 888
AnnouncementMay 2023December 2020
Process node6nm5nm
Network support5G, 4G, 3G, 2G5G, 4G, 3G, 2G
Target segmentMid-range 5GFlagship 5G
Phone exampleLava Agni 2 5GMultiple flagship smartphones
WarrantyDepends on phone manufacturerDepends on phone manufacturer
DimensionsDepends on phoneDepends on phone
WeightDepends on phoneDepends on phone

Which chipset has the stronger CPU?

Dimensity 7050 uses two Cortex-A78 performance cores clocked up to 2.6GHz and six Cortex-A55 efficiency cores reaching 2GHz. Snapdragon 888 combines one Cortex-X1 core up to 2.84GHz with three Cortex-A78 and four Cortex-A55 cores.

The Snapdragon 888 has a higher maximum clock speed and includes a Cortex-X1 prime core. This architecture is designed for demanding smartphone workloads.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
CPUOcta-coreOcta-core
Architecture2 × Cortex-A78 + 6 × Cortex-A551 × Cortex-X1 + 3 × Cortex-A78 + 4 × Cortex-A55
Prime coreNot applicableCortex-X1 up to 2.84GHz
Performance coresCortex-A78 up to 2.6GHzCortex-A78 up to 2.42GHz
Efficiency coresCortex-A55 up to 2GHzCortex-A55 up to 1.8GHz
Maximum clock speed2.6GHz2.84GHz
64-bitYesYes

How do the graphics capabilities compare?

Dimensity 7050 uses the Arm Mali-G68 MC4 GPU and MediaTek HyperEngine gaming technology. Snapdragon 888 uses the Adreno 660 GPU and Snapdragon Elite Gaming features.

The Snapdragon 888 is positioned for higher-end graphics workloads, while the Dimensity 7050 focuses on balanced graphics performance and power efficiency.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
GPUArm Mali-G68 MC4Adreno 660
GPU frequencyNot specifiedUp to 840MHz
Gaming technologyMediaTek HyperEngineSnapdragon Elite Gaming
AI processorMediaTek NPU 550Hexagon 780
RAM supportLPDDR5, LPDDR4XLPDDR5
CoolingDevice dependentDevice dependent
Operating systemDevice dependentDevice dependent
UIDevice dependentDevice dependent
Software versionDevice dependentDevice dependent

How does memory support differ?

Memory support affects multitasking, app loading, and data handling. Dimensity 7050 supports LPDDR5 and LPDDR4X memory, while Snapdragon 888 supports LPDDR5 memory.

Both chipsets support UFS 3.1 storage. Actual RAM, storage, and expandable storage options depend on the smartphone manufacturer and model.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
Memory typeLPDDR5, LPDDR4XLPDDR5
Storage supportUFS 3.1, UFS 2.1UFS 3.1
RAM optionsDevice dependentDevice dependent
Storage optionsDevice dependentDevice dependent
Expandable storageDevice dependentDevice dependent

Which chipset offers better camera and video support?

Dimensity 7050 supports cameras of up to 200MP and 4K HDR video recording. Snapdragon 888 also supports cameras of up to 200MP, along with 8K video recording at 30fps.

Both chipsets include AI-based imaging capabilities and support 4K HDR video. Snapdragon 888 offers higher maximum video recording resolution in the provided specifications.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
Maximum camera supportUp to 200MPUp to 200MP
Video capability4K at 30fps8K at 30fps
HDR video4K HDR4K HDR
ISPIntegrated camera enginesSpectra 580 ISP
AI imagingNPU 550Hexagon 780
Camera features3X HDR-ISP, MFNR, 3DNR, AINRTriple ISP, HDR processing

Which chipset has better connectivity?

Both chipsets support 5G connectivity. Dimensity 7050 supports dual 5G SIMs, 5G carrier aggregation, Wi-Fi 6E, and Bluetooth 5.2.

Snapdragon 888 uses the Snapdragon X60 5G Modem-RF system and also supports 5G carrier aggregation and Wi-Fi 6E. It additionally supports USB 3.2 and Qualcomm Aqstic audio in the provided specifications.

SpecificationMediaTek Dimensity 7050Qualcomm Snapdragon 888
5GYesYes
5G modemIntegratedSnapdragon X60 5G Modem-RF
5G SIMDual 5G SIMDual SIM 5G support
5G carrier aggregationYesYes
Wi-FiWi-Fi 6EWi-Fi 6E
Bluetooth5.25.2
GPS/GNSSGPS, BeiDou, GLONASS, Galileo, QZSS, NavICGPS, GLONASS, BeiDou, Galileo, QZSS
USBDevice dependentUSB 3.2
NFCDevice dependentSupported
Fingerprint sensorDevice dependentDevice dependent
Face unlockDevice dependentDevice dependent
SpeakersDevice dependentDevice dependent
AudioDevice dependentQualcomm Aqstic audio

MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 - Benchmark

AnTuTu 11

AnTuTu 11 measures CPU, GPU, memory, and overall user experience performance. The MediaTek Dimensity 7050 scores 806,012, while Qualcomm Snapdragon 888 scores 1,119,714. This gives Snapdragon 888 a higher overall score for demanding workloads.

ComponentMediaTek Dimensity 7050Qualcomm Snapdragon 888
CPU310,680429,098
GPU80,663176,076
Memory176,922195,254
UX237,747319,286
Total score806,0121,119,714

Geekbench 6

Geekbench 6 measures CPU performance through single-core and multi-core tests. The Dimensity 7050 scores 1,061 in single-core and 2,398 in multi-core testing. Snapdragon 888 scores 1,488 and 3,373, respectively, indicating stronger CPU performance for demanding apps and multitasking.

ComponentMediaTek Dimensity 7050Qualcomm Snapdragon 888
Single-Core Score1,0611,488
Multi-Core Score2,3983,373
Asset compression117.2 MB/sec156.9 MB/sec
HTML 5 Browser61.2 pages/sec86.4 pages/sec
PDF Renderer88 Mpixels/sec104.6 Mpixels/sec
Image detection44.8 images/sec72.9 images/sec
HDR76.7 Mpixels/sec104.7 Mpixels/sec
Background blur6.71 images/sec12.1 images/sec
Photo processing21.3 images/sec26.5 images/sec
Ray tracing3.21 Mpixels/sec4.04 Mpixels/sec

3DMark

3DMark measures graphics performance in demanding visual workloads. In the Steel Nomad Light test, the Dimensity 7050 scores 233 with 97% stability. Snapdragon 888 scores 505 with 77% stability, but its higher score comes with lower stability in this test.

ComponentMediaTek Dimensity 7050Qualcomm Snapdragon 888
TestSteel Nomad LightSteel Nomad Light
Stability97%77%
Graphics test2 FPS4 FPS
Score233505

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FAQs

General

What are the architecture differences between MediaTek Dimensity 7050 and Qualcomm Snapdragon 888?

The MediaTek Dimensity 7050 uses a 6nm architecture with two Cortex-A78 cores clocked up to 2.6GHz and six Cortex-A55 efficiency cores up to 2GHz. Qualcomm Snapdragon 888 uses a smaller 5nm process and combines one Cortex-X1 core at 2.84GHz, three Cortex-A78 cores at 2.42GHz, and four Cortex-A55 cores at 1.8GHz. This gives Snapdragon 888 a more performance-focused CPU configuration for demanding smartphone workloads.

The MediaTek Dimensity 7050 uses an Arm Mali-G68 MC4 GPU with MediaTek HyperEngine gaming enhancements. Qualcomm Snapdragon 888 uses the Adreno 660 GPU and Snapdragon Elite Gaming features. Snapdragon 888 is positioned for flagship gaming and offers stronger graphics capabilities. Dimensity 7050 focuses on balanced gaming and power efficiency. Both can support demanding mobile games, but actual gaming performance also depends on the phone's cooling system, display, RAM, software optimisation, and game settings.

MediaTek Dimensity 7050 is built using a 6nm-class process, while Qualcomm Snapdragon 888 uses a smaller 5nm process. The smaller fabrication process can help improve power efficiency and transistor density, although real-world battery life depends on the complete smartphone design. Dimensity 7050 combines its 6nm design with MediaTek 5G UltraSave technologies. Snapdragon 888's 5nm design supports its flagship performance focus. Both chipsets integrate 5G connectivity directly into their respective platforms.

MediaTek Dimensity 7050 has integrated 5G support with 2CC carrier aggregation, dual 5G SIM support, SA and NSA modes, Wi-Fi 6E, Bluetooth 5.2, and multiple GNSS systems including NavIC. Snapdragon 888 uses the Snapdragon X60 5G Modem-RF system and supports advanced 5G connectivity, Wi-Fi 6E, Bluetooth 5.2, and multiple positioning systems. Features available on a finished phone can vary based on the manufacturer's implementation and regional network support.

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