When comparing the MediaTek Dimensity 8200 vs Qualcomm Snapdragon 870, several key differences and similarities stand out, affecting performance, efficiency, and overall user experience. The MediaTek Dimensity 8200, manufactured using a 4nm process, offers significant advancements in graphics performance with its Mali-G610 MP6 GPU, providing a notable improvement in gaming and multimedia tasks. In contrast, the Qualcomm Snapdragon 870, built on a 7nm process, features the Adreno 650 GPU, which, while powerful, lags behind in graphical capabilities compared to its competitor.
The MediaTek Dimensity 8200 showcases better memory bandwidth at 51.2 GB/s, compared to 44 GB/s of the Snapdragon 870, enhancing its ability to handle memory-intensive applications smoothly. Additionally, in benchmark tests like AnTuTu, the Dimensity 8200 scores higher, indicating superior overall performance. However, the Snapdragon 870 maintains a slight edge in CPU clock speed, operating at 3.2 GHz versus 3.1 GHz for the Dimensity 8200, which can translate to marginally faster processing speeds in certain scenarios. For users looking to optimise their experience with
MediaTek processor phones or the
best gaming mobile phones, understanding these nuances can help in making an informed decision. Whether it is for gaming, multitasking, or general use, both processors offer compelling features, but the choice ultimately depends on specific needs and preferences in terms of performance and efficiency.
Technical specifications - MediaTek Dimensity 8200 vs Qualcomm Snapdragon 870
General info
The MediaTek Dimensity 8200 and Qualcomm Snapdragon 870 are prominent SoCs (System on Chips) used in modern smartphones. The Dimensity 8200 was announced on 20 November 2023, while the Snapdragon 870 was announced on 15 January 2021. These processors cater to different segments, with the Snapdragon 870 positioned as a high-performance mid-range option and the Dimensity 8200 as a newer entrant with advanced capabilities.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Announced Date | 20 November 2023 | 15 January 2021 |
| Class | Mid Range | High-Performance mid range |
| Model number | MT6896Z | SM8250-AC |
| Brand | MediaTek | Qualcomm |
CPU
The CPUs in these processors exhibit notable differences in architecture and processing power. The MediaTek Dimensity 8200 utilises the Cortex-A78 and Cortex-A55 cores, while the Snapdragon 870 employs the Cortex-A77 and Cortex-A55 cores. Both have eight cores, but the Dimensity 8200's advanced 4nm manufacturing process gives it an edge in efficiency.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Architecture | 1x Cortex-A78, 3x Cortex-A78, 4x Cortex-A55 | 1x Cortex-A77, 3x Cortex-A77, 4x Cortex-A55 |
| Cores | 8 | 8 |
| Frequency | 3.1 GHz | 3.2 GHz |
| Instruction set | ARMv8-A (64-bit) | ARMv8-A (64-bit) |
| Process | 4nm | 7nm |
| TDP (Sustained power limit) | 6W | 10W |
| Manufacturing | TSMC | TSMC |
Graphics
Graphics capabilities are crucial for gaming and multimedia performance. The Dimensity 8200 features the Mali-G610 MP6 GPU, while the Snapdragon 870 is equipped with the Adreno 650 GPU. The Mali-G610 offers superior graphical performance with higher GPU frequency and better execution units, making it a preferable choice for gamers.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| SoC | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| GPU name | Mali-G610 MP6 | Adreno 650 |
| Architecture | Mali | Adreno |
| GPU frequency | 950 MHz | 670 MHz |
| Execution units | 6 | 2 |
| Shading units | 512 | No |
| Total shaders | No | No |
| FLOPS | 1.442 TFLOPS | 1.3721 TFLOPS |
| Vulkan Version | 1.3 | 1.1 |
| OpenCL Version | 2.0 | 2.0 |
| DirectX Version | No | 12.1 |
Memory
Memory specifications impact the overall speed and multitasking capabilities of a device. The Dimensity 8200 supports LPDDR5 memory with a maximum bandwidth of 51.2 GB/s, while the Snapdragon 870 supports both LPDDR5 and LPDDR4X with a bandwidth of 44 GB/s, making the Dimensity 8200 more efficient in handling memory-intensive applications.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Memory type | LPDDR5 | LPDDR5, LPDDR4X |
| Memory frequency | 3200 MHz | 2750 MHz |
| Bus | 4x 16 bit | 4x 16 bit |
| Max bandwidth | 51.2 GB/s | 44 GB/s |
| Max size | 16 GB | 16 GB |
Multimedia (ISP)
The multimedia capabilities of these processors influence the camera and video performance. The Dimensity 8200 supports up to a 320MP camera and 4K video capture, while the Snapdragon 870 supports up to a 200MP camera and similar video capabilities. Both offer extensive codec support for various audio and video formats.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Storage type | UFS 3.1 | UFS 3.0, UFS 3.1 |
| Max display resolution | 2960 x 1440 | 3840 x 2160 |
| Max camera resolution | 320MP | 200MP |
| Video capture | 4K at 60FPS | 8K at 30FPS, 4K at 60FPS |
| Video playback | 4K at 60FPS | 8K at 30FPS, 4K at 60FPS |
| Video codecs | H.264, H.265, AV1, VP9 | H.264, H.265, VP8, VP9 |
| Audio codecs | AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC | AAC, AIFF, CAF, MP3, MP4, WAV |
Connectivity and network
Connectivity features are essential for network performance and internet speed. The Dimensity 8200 offers advanced 5G support with download speeds up to 7500 Mbps, while the Snapdragon 870 provides up to 4700 Mbps. Both support Wi-Fi 6 and Bluetooth 5, ensuring robust connectivity options.
| Feature | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Modem | MediaTek UltraSave 2.0 | Snapdragon X55 |
| 4G support | LTE Cat. 21 | LTE Cat. 22 |
| 5G support | Yes | Yes |
| Download Speed | Up to 7500 Mbps | Up to 4700 Mbps |
| Upload Speed | Up to 3000 Mbps | Up to 2500 Mbps |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.3 | 5.2 |
| Navigation | GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC | GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC |
MediaTek Dimensity 8200 vs Qualcomm Snapdragon 870 - Benchmarking
In the comparison of MediaTek Dimensity 8200 vs Qualcomm Snapdragon 870, both processors show strong performance in various benchmark tests. The Dimensity 8200 often surpasses the Snapdragon 870 in graphics and overall performance, making it a robust choice for modern smartphones and gaming devices.
AnTuTu 10
AnTuTu 10 benchmarks provide a comprehensive evaluation of a processor's capabilities across several metrics. The MediaTek Dimensity 8200 scores higher than the Snapdragon 870, reflecting its superior performance in CPU, GPU, memory, and UX components. This test highlights the Dimensity 8200's ability to handle intensive tasks efficiently.
| Component | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| CPU | 215,000 | 190,000 |
| GPU | 320,000 | 280,000 |
| Memory | 150,000 | 130,000 |
| UX | 258,370 | 184,669 |
| Total score | 903,370 | 784,669 |
GeekBench 6
GeekBench 6 evaluates the single-core and multi-core performance of processors, along with various real-world tasks like asset compression and photo processing. The MediaTek Dimensity 8200 outperforms the Snapdragon 870 in both single-core and multi-core tests, demonstrating its advanced processing power and efficiency in handling complex applications.
| Component | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Single core | 1229 | 1151 |
| Multi-core | 3924 | 3336 |
| Asset compression | 650 | 600 |
| HTML5 browse | 520 | 480 |
| PDF render | 680 | 640 |
| Image detection | 890 | 820 |
| HDR | 950 | 900 |
| Background blur | 830 | 780 |
| Photo processing | 710 | 670 |
| Ray tracing | 694 | 660 |
3DMark
3DMark benchmarks measure the graphical performance of processors, focusing on stability, graphics tests, and overall score. The MediaTek Dimensity 8200 achieves higher scores in 3DMark compared to the Snapdragon 870, indicating better graphics performance, which is crucial for gaming and multimedia applications.
| Component | MediaTek Dimensity 8200 | Qualcomm Snapdragon 870 |
| Stability | 98% | 95% |
| Graphics test | 6200 | 4600 |
| Overall score | 6188 | 4265 |
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