MediaTek Dimensity 8100 features a 5nm TSMC process, octa-core CPU up to 2.85GHz, Mali-G610 MC6 GPU, LPDDR5 memory, UFS 3.1 storage and 4.7Gbps 5G, while Qualcomm Snapdragon 888 combines a 5nm Samsung process, octa-core CPU up to 2.84GHz, Adreno 660 GPU, LPDDR5 memory, UFS 3.1 storage and 7.5Gbps 5G. These hardware specifications determine gaming performance, AI processing, camera capabilities, multitasking and wireless connectivity.
General
MediaTek Dimensity 8100 uses TSMC 5nm fabrication, while Qualcomm Snapdragon 888 uses Samsung 5nm fabrication. Both integrate 5G SA/NSA connectivity, delivering faster network performance and improved power efficiency for streaming, gaming and everyday usage.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| Brand | MediaTek | Qualcomm |
| Launch | March 2022 | December 2020 |
| Model number | MT6895Z | SM8350 |
| Target segment | Upper mid-range | Flagship |
| Network | 5G SA/NSA, 4G LTE | 5G SA/NSA, 4G LTE |
| Process node | 5nm | 5nm |
| Foundry | TSMC N5 | Samsung 5LPE |
| 64-bit | Yes | Yes |
CPU
MediaTek Dimensity 8100 combines 4 Cortex-A78 cores up to 2.85GHz and 4 Cortex-A55 cores at 2.0GHz, while Qualcomm Snapdragon 888 integrates 1 Cortex-X1 core at 2.84GHz, 3 Cortex-A78 cores at 2.42GHz and 4 Cortex-A55 cores at 1.80GHz. These CPU configurations improve gaming, application responsiveness, multitasking and productivity workloads.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| CPU architecture | ARMv8.2-A | ARMv8.4-A |
| Total cores | 8 | 8 |
| Prime core | — | 1× Cortex-X1 @ 2.84GHz |
| Performance cores | 4× Cortex-A78 @ 2.85GHz | 3× Cortex-A78 @ 2.42GHz |
| Efficiency cores | 4× Cortex-A55 @ 2.0GHz | 4× Cortex-A55 @ 1.80GHz |
| Maximum clock | 2.85GHz | 2.84GHz |
| Instruction set | 64-bit ARMv8 | 64-bit ARMv8.4 |
| Process | TSMC 5nm | Samsung 5nm |
Graphics
MediaTek Dimensity 8100 integrates the Mali-G610 MC6 GPU with FHD+ 144Hz display support, while Qualcomm Snapdragon 888 uses the Adreno 660 GPU with QHD+ 144Hz support. These graphics specifications enable smoother gameplay, HDR rendering and GPU-accelerated imaging.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| GPU | Mali-G610 MC6 | Adreno 660 |
| GPU architecture | ARM Valhall Gen 3 | Qualcomm Adreno |
| Gaming capability | FHD+ 144Hz | QHD+ 144Hz |
| Vulkan | 1.1 | 1.1 |
| OpenGL ES | 3.2 | 3.2 |
| Video acceleration | H.264, HEVC, AV1 decode | H.264, HEVC, VP9, AV1 decode |
| AI graphics | HyperEngine 5.0 | Snapdragon Elite Gaming |
Memory
MediaTek Dimensity 8100 supports LPDDR5 memory up to 6400Mbps with 51.2GB/s bandwidth, while Qualcomm Snapdragon 888 supports LPDDR5 memory with 51.2GB/s bandwidth through a 64-bit memory interface. These memory specifications improve application loading, gaming, multitasking and video editing.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| Memory type | LPDDR5 | LPDDR5 |
| Maximum memory frequency | 6400Mbps | 3200MHz |
| Memory bus width | 4×16-bit (64-bit) | 4×16-bit (64-bit) |
| Maximum bandwidth | 51.2GB/s | 51.2GB/s |
| Maximum RAM support | 16GB | 16GB |
| ECC memory | No | No |
Multimedia (ISP)
MediaTek Dimensity 8100 supports 200MP cameras and 4K60 HDR10+ recording, while Qualcomm Snapdragon 888 supports 200MP cameras, 8K24 recording and 4K120 video. These multimedia specifications enhance photography, HDR video capture and AI-powered image processing.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| ISP | Imagiq 780 | Spectra 580 |
| ISP generation | 14-bit HDR ISP | Triple 14-bit ISP |
| Storage support | UFS 3.1 | UFS 3.1 |
| Maximum display resolution | WQHD+ | 4K UHD |
| Maximum refresh rate | 168Hz (FHD+)/120Hz (WQHD+) | 144Hz (QHD+)/144Hz (FHD+) |
| Maximum camera resolution | 200MP | 200MP |
| Multi-camera support | Dual 32MP | Triple concurrent capture |
| Video recording | 4K60 HDR10+ | 8K24, 4K120 |
| Video playback | 4K AV1, HEVC, VP9 | 8K HEVC, VP9, AV1 |
| Video codecs | AV1, HEVC, H.264, VP9 | AV1, HEVC, H.264, VP9 |
| Audio codecs | AAC, LDAC, aptX Adaptive, FLAC | AAC, aptX Adaptive, LDAC, FLAC |
Connectivity and network
MediaTek Dimensity 8100 integrates 4.7Gbps 5G, Wi-Fi 6E and Bluetooth 5.3, while Qualcomm Snapdragon 888 combines 7.5Gbps 5G, Wi-Fi 6E and Bluetooth 5.2. These connectivity specifications improve download speeds, cloud gaming, streaming quality and wireless accessory performance.
| Specification | MediaTek Dimensity 8100 | Qualcomm Snapdragon 888 |
|---|
| Cellular modem | MediaTek 5G Release 16 | Snapdragon X60 5G |
| 5G support | SA/NSA | SA/NSA |
| Maximum download speed | 4.7Gbps | 7.5Gbps |
| Maximum upload speed | 2.5Gbps | 3.0Gbps |
| Wi-Fi | Wi-Fi 6E | Wi-Fi 6E |
| Bluetooth | 5.3 | 5.2 |
| Navigation | GPS, GLONASS, Galileo, BeiDou, NavIC, QZSS | GPS, GLONASS, Galileo, BeiDou, NavIC, QZSS |
