When comparing the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870, it is evident that both chipsets offer impressive capabilities for modern smartphones, providing users with exceptional performance, efficiency, and advanced features. The MediaTek Dimensity 8100 boasts a 5nm manufacturing process, integrating eight cores with a combination of Cortex-A78 and Cortex-A55, offering a balanced mix of power and efficiency. Its Mali-G610 MC6 GPU ensures robust graphics performance, making it a formidable contender for gaming and multimedia applications. Additionally, with support for up to 16GB of LPDDR5 memory and an extensive range of connectivity options, including integrated 5G, the Dimensity 8100 is designed for high-speed data transfers and seamless multitasking. For those interested in exploring devices with this chipset,
MediaTek processor phones provide a variety of options to choose from.
On the other hand, the Qualcomm Snapdragon 870 is a slightly older yet highly competitive chipset featuring a 7nm manufacturing process and an octa-core setup that includes a high-performance Cortex-A77 core clocked at up to 3.2 GHz. This configuration ensures excellent single-threaded performance, which is crucial for applications that demand rapid processing speeds. The Adreno 650 GPU within the Snapdragon 870 delivers exceptional graphics capabilities, supporting 4K video playback, and advanced gaming features. Furthermore, this chipset supports up to 16GB of LPDDR5 memory and offers extensive connectivity options, including 5G and Wi-Fi 6, ensuring fast and reliable connections. If you are looking for devices powered by this chipset, you can explore a range of
Snapdragon processor phones that cater to various needs and budgets. Both processors cater to high-end smartphones, ensuring that users get top-notch performance and features for their mobile computing needs.
Technical specifications - MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870
General info
Both the MediaTek Dimensity 8100 and Qualcomm Snapdragon 870 are high-performance processors aimed at enhancing the user experience in mobile devices. These chipsets bring advanced features for better performance, efficiency, and connectivity.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Announced | 01-March-2022 | 19-January-2021 |
| Class | High-end | High-end |
| Model number | MT6875 | SM8250-AC |
| Brand | MediaTek | Qualcomm |
CPU
The CPU section highlights the core processing capabilities of these chipsets, focusing on the architecture, cores, and manufacturing processes that determine their overall efficiency and power consumption.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Architecture | 64-bit ARMv8-A | 64-bit ARMv8-A |
| Cores | 8 (4x Cortex-A78, 4x Cortex-A55) | 8 (1x Cortex-A77, 3x Cortex-A77, 4x Cortex-A55) |
| Frequency | Up to 2.85 GHz | Up to 3.2 GHz |
| Instruction set | ARMv8-A | ARMv8-A |
| Process | 5nm | 7nm |
| TDP (Sustained power limit) | 10W | 10W |
| Manufacturing | TSMC | TSMC |
Graphics
The graphics section delves into the graphical processing units (GPUs) integrated within these SoCs, focusing on their capabilities for handling high-end graphics tasks and rendering.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| SoC | Dimensity 8100 | Snapdragon 870 |
| GPU name | Mali-G610 MC6 | Adreno 650 |
| Architecture | Valhall | Adreno |
| GPU frequency | 850 MHz | 670 MHz |
| Execution units | 6 | 1 |
| Shading units | 128 | 384 |
| Total shaders | 384 | 384 |
| FLOPS | 2.5 TFLOPS | 1.2 TFLOPS |
| Vulkan version | 1.2 | 1.1 |
| OpenCL version | 2.0 | 2.0 |
| DirectX version | 12.1 | 12.1 |
Memory
Memory capabilities highlight the types and speeds of memory supported by each chipset, essential for understanding their data handling and multitasking performance.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Memory type | LPDDR5 | LPDDR5 |
| Memory frequency | 3200 MHz | 2750 MHz |
| Bus | 4x 16-bit | 4x 16-bit |
| Max bandwidth | 51.2 GB/s | 44 GB/s |
| Max size | 16GB | 16GB |
Multimedia (ISP)
The multimedia capabilities indicate how well these chipsets can handle various media tasks, including video capture and playback, as well as the maximum resolution for displays and cameras.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Storage type | UFS 3.1 | UFS 3.1 |
| Max display resolution | 2520 x 1080 | 3840 x 2160 |
| Max camera resolution | 200 MP | 200 MP |
| Video capture | 4K at 60 FPS | 8K at 30 FPS |
| Video playback | 4K at 60 FPS | 8K at 30 FPS |
| Video codecs | H.264, H.265, AV1 | H.264, H.265 |
| Audio codecs | AAC, AIFF, CAF | AAC, AIFF, CAF |
Connectivity and network
The connectivity and network capabilities of the chipsets showcase their ability to connect to various network standards and the speeds they can achieve.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Modem | Integrated 5G | Snapdragon X55 |
| 4G support | Yes | Yes |
| 5G support | Yes | Yes |
| Download speed | Up to 4.7 Gbps | Up to 7.5 Gbps |
| Upload speed | Up to 2.5 Gbps | Up to 3 Gbps |
| Wi-Fi | 6 | 6 |
| Bluetooth | 5.2 | 5.1 |
| Navigation | GPS, GLONASS, BeiDou | GPS, GLONASS, BeiDou |
MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870 - Benchmarking
Benchmark comparisons help in understanding the real-world performance of these chipsets under various tests and conditions.
AnTuTu 10
AnTuTu 10 is a popular benchmarking tool that measures various aspects of a chipset's performance, including CPU, GPU, memory, and user experience (UX).
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| CPU | 210,000 | 190,000 |
| GPU | 320,000 | 310,000 |
| Memory | 110,000 | 100,000 |
| UX | 150,000 | 140,000 |
| Total score | 790,000 | 740,000 |
GeekBench 6
GeekBench 6 measures the performance of the CPU in different scenarios such as compression, rendering, and image processing.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Asset compression | 1,500 | 1,400 |
| HTML 5 browse | 1,800 | 1,750 |
| PDF render | 1,600 | 1,500 |
| Image detection | 1,700 | 1,650 |
| HDR | 1,600 | 1,500 |
| Background blur | 1,500 | 1,450 |
| Photo processing | 1,800 | 1,750 |
| Ray tracing | 1,700 | 1,650 |
3DMark
3DMark is a benchmarking tool specifically designed to measure the graphical performance and stability of chipsets through rigorous testing.
| Component | MediaTek Dimensity 8100 | Qualcomm Snapdragon 870 |
| Stability | 98% | 97% |
| Graphics test | 4,500 | 4,200 |
| Score | 9,000 | 8,700 |
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