MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870

MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870

Explore the MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870 comparison, covering specifications, performance, and features. Get Easy EMIs on the latest phones from Bajaj Finance.

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In summary

The MediaTek Dimensity 8100 and Qualcomm Snapdragon 870 are high-performance processors built for gaming, multitasking, and premium smartphone experiences. While both deliver excellent everyday performance, they differ in architecture, graphics capabilities, memory support, and gaming technologies.


  • Process and CPU: The MediaTek Dimensity 8100 is built on TSMC's efficient 5nm process and features four Cortex-A78 performance cores clocked at up to 2.85GHz. The Qualcomm Snapdragon 870 uses TSMC's 7nm process and combines a Prime Cortex-A77 core clocked at up to 3.2GHz with a high-performance Kryo CPU architecture.
  • Graphics: The MediaTek Dimensity 8100 features the Mali-G610 MC6 GPU based on the Arm Valhall architecture, while the Qualcomm Snapdragon 870 integrates the Adreno 650 GPU for smooth gaming and graphics-intensive workloads.
  • Memory support: The MediaTek Dimensity 8100 supports LPDDR5 memory with data rates of up to 6,400Mbps, whereas the Qualcomm Snapdragon 870 also supports LPDDR5 memory but with lower maximum memory speeds.
  • Gaming and connectivity: The MediaTek Dimensity 8100 includes HyperEngine 5.0 gaming technology and an integrated 5G modem. The Qualcomm Snapdragon 870 offers Snapdragon Elite Gaming features alongside the Snapdragon X55 5G Modem-RF for fast and reliable connectivity.


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MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870 – Overview

MediaTek Dimensity 8100 is a 5G upper-mid-range processor launched in 2022 with a TSMC 5nm fabrication process, 4x Cortex-A78@2.85GHz and 4x Cortex-A55@2.0GHz CPU cores, Mali-G610 MC6 GPU, LPDDR5 memory support up to 6,400Mbps and 200MP camera support. Qualcomm Snapdragon 870 is a 5G flagship-tier processor launched in 2021 with TSMC 7nm fabrication, 1x Cortex-A77@3.2GHz + 3x Cortex-A77@2.42GHz + 4x Cortex-A55@1.8GHz CPU cores, Adreno 650 GPU, LPDDR5 memory support and Spectra 480 ISP supporting 200MP camera sensors.


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Technical specifications - MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870

The MediaTek Dimensity 8100 and Qualcomm Snapdragon 870 are powerful mobile processors designed for high-performance smartphones. Both chipsets deliver excellent gaming, multitasking, AI processing, and 5G connectivity. However, they differ in CPU architecture, graphics capabilities, memory support, multimedia features, and network performance. The comparison below highlights their key specifications to help you understand their strengths.

General

Both processors are manufactured by TSMC and support 5G connectivity. The MediaTek Dimensity 8100 is built on a more efficient 5nm process, while the Qualcomm Snapdragon 870 is based on a 7nm process and is designed for flagship-grade performance.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
ManufacturerMediaTekQualcomm
Model numberMT6895ZSM8250-AC
Launch dateMarch 2022January 2021
Target segmentUpper mid-range 5G smartphonesFlagship 5G smartphones
Network support5G5G
Manufacturing process5nm7nm
FoundryTSMCTSMC
CPU architectureARM Cortex-A78 / Cortex-A55ARM Cortex-A77 / Cortex-A55

CPU

The CPU determines how efficiently a smartphone handles gaming, multitasking, and demanding applications. The MediaTek Dimensity 8100 features four Cortex-A78 performance cores, while the Snapdragon 870 combines a high-clocked Prime core with three additional Cortex-A77 performance cores for excellent single-core performance.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
CPU coresOcta-coreOcta-core
Performance cores4 × Cortex-A78 @ 2.85GHz1 × Cortex-A77 @ 3.2GHz + 3 × Cortex-A77 @ 2.42GHz
Efficiency cores4 × Cortex-A55 @ 2.0GHz4 × Cortex-A55 @ 1.8GHz
Maximum clock speed2.85GHz3.2GHz
Instruction setARMv8.2-A 64-bitARMv8-A 64-bit
Process node5nm7nm
64-bit supportYesYes

Graphics

The GPU plays a key role in gaming, graphics rendering, and multimedia performance. The MediaTek Dimensity 8100 features the Mali-G610 MC6 GPU with HyperEngine 5.0 gaming technology, while the Snapdragon 870 integrates the Adreno 650 GPU with Snapdragon Elite Gaming features for smooth and immersive gameplay.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
GPUMali-G610 MC6Adreno 650
GPU architectureArm ValhallQualcomm Adreno architecture
GPU cores6 coresCustom Adreno architecture
Vulkan supportVulkan 1.3Vulkan 1.1
OpenGL ES supportOpenGL ES 3.2OpenGL ES 3.2
Gaming technologyMediaTek HyperEngine 5.0Snapdragon Elite Gaming
Video accelerationH.264, H.265, AV1 decodeH.264, H.265 decode

Memory

Memory performance affects app loading, multitasking, and gaming responsiveness. Both processors support LPDDR5 memory, while the MediaTek Dimensity 8100 offers higher memory bandwidth for faster data transfer and improved overall performance.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
Memory typeLPDDR5 / LPDDR4XLPDDR5 / LPDDR4X
Maximum memory frequencyUp to 6,400MbpsUp to 2,750MHz
Memory bus width64-bit64-bit
Maximum bandwidthUp to 51.2GB/sUp to 44GB/s
Maximum RAM support16GB16GB
ECC memory supportNoYes

Multimedia (ISP)

The image signal processor (ISP) enhances photography, video recording, and display performance. Both processors support high-resolution cameras and 4K HDR video recording, making them suitable for content creation and multimedia applications.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
ISPMediaTek Imagiq 780Qualcomm Spectra 480
ISP processing capability5Gbps image processing2 gigapixels/s image processing
Storage supportUFS 3.1UFS 3.1
Maximum display resolution3200 × 1440 pixel3840 × 2160 pixel
Maximum refresh rate120Hz (WQHD+)144Hz (QHD+)
Maximum camera resolution200MP200MP
Multi-camera supportDual camera with AI processingDual camera concurrent processing
Video recording4K at 60fps HDR10+4K at 60fps HDR10+
Video playback4K HDR8K HDR
Video codecsH.264, H.265, AV1H.264, H.265, VP9
Audio codecsAAC, AIFF, FLAC, MP3AAC, ALAC, FLAC, MP3

Connectivity and network

Reliable connectivity ensures fast downloads, smooth streaming, and responsive online gaming. The MediaTek Dimensity 8100 integrates the MediaTek M80 5G modem, while the Snapdragon 870 features the Snapdragon X55 5G Modem-RF with higher peak download speeds and mmWave support.

SpecificationMediaTek Dimensity 8100Qualcomm Snapdragon 870
Cellular modemMediaTek M80 5G modemSnapdragon X55 5G Modem-RF
Network support5G Sub-6GHz, 4G LTE5G Sub-6GHz, mmWave, 4G LTE
Maximum download speed4.7Gbps7.5Gbps
Maximum upload speed2.5Gbps3Gbps
Wi-FiWi-Fi 6 (802.11ax)Wi-Fi 6 (802.11ax)
Bluetooth5.35.2
NavigationGPS, GLONASS, BeiDou, Galileo, QZSSGPS, GLONASS, BeiDou, Galileo, QZSS

MediaTek Dimensity 8100 vs Qualcomm Snapdragon 870 - Benchmarking

Benchmark scores provide a useful indication of how processors perform in real-world tasks. The MediaTek Dimensity 8100 generally delivers stronger CPU and GPU performance than the Qualcomm Snapdragon 870, thanks to its newer 5nm architecture and improved graphics capabilities. Since the two chipsets are commonly benchmarked using different versions of AnTuTu and Geekbench, the scores below should be viewed as approximate comparisons rather than direct one-to-one results.

Benchmark parameterMediaTek Dimensity 8100Qualcomm Snapdragon 870
AnTuTu~850,000 (v10)~700,000 (v9)
Geekbench Single-core~1,270 (v6)~1,000 (v5)
Geekbench Multi-core~4,100 (v6)~3,400 (v5)
3DMark Sling Shot Extreme Overall~5,500~5,700

AnTuTu

AnTuTu measures overall processor performance by evaluating the CPU, GPU, memory, and user experience (UX). The MediaTek Dimensity 8100 achieves a higher overall score, reflecting better performance in multitasking, gaming, app launches, and everyday responsiveness. Since these scores come from different AnTuTu versions, they should be used only as a general performance reference.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 870
CPU~220,000~190,000
GPU~320,000~250,000
Memory~140,000~120,000
UX~170,000~140,000
Total score~850,000~700,000

Geekbench

Geekbench measures CPU performance across single-core and multi-core workloads, including web browsing, image processing, and multitasking. The MediaTek Dimensity 8100 records higher benchmark scores, although the results are based on Geekbench 6, while the Snapdragon 870 scores are from Geekbench 5. As a result, these figures should be considered indicative rather than directly comparable.

BenchmarkMediaTek Dimensity 8100Qualcomm Snapdragon 870
Single-core~1,270 (Geekbench 6)~1,000 (Geekbench 5)
Multi-core~4,100 (Geekbench 6)~3,400 (Geekbench 5)

3DMark

3DMark evaluates graphics performance and GPU stability during demanding workloads. Both processors deliver excellent gaming performance, with the Snapdragon 870 achieving a slightly higher Sling Shot Extreme score. However, the MediaTek Dimensity 8100 offers excellent graphics stability and sustained performance during extended gaming sessions.

ComponentMediaTek Dimensity 8100Qualcomm Snapdragon 870
Sling Shot Extreme – Graphics~5,800~6,000
Sling Shot Extreme – Physics~4,000~4,500
Overall score~5,500~5,700
Stability~99%~98%

Disclaimer: Benchmark scores are approximate and may vary depending on the smartphone model, RAM configuration, software version, benchmark version, and cooling system.

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FAQs

General

What are the architecture differences between MediaTek Dimensity 8100 and Qualcomm Snapdragon 870?

MediaTek Dimensity 8100 uses a 5nm TSMC process with 4x Cortex-A78@2.85GHz performance cores and 4x Cortex-A55@2.0GHz efficiency cores based on ARMv8.2-A architecture. Qualcomm Snapdragon 870 uses a 7nm TSMC process with 1x Cortex-A77@3.2GHz Prime core, 3x Cortex-A77@2.42GHz performance cores, and 4x Cortex-A55@1.8GHz efficiency cores based on ARMv8 architecture. Both processors use 8-core CPU layouts for Android smartphone workloads.

MediaTek Dimensity 8100 integrates Mali-G610 MC6 GPU based on Arm Valhall architecture, while Qualcomm Snapdragon 870 uses Adreno 650 GPU architecture. Dimensity 8100 supports Vulkan 1.3 and Snapdragon 870 supports Vulkan 1.1. Gaming workloads such as BGMI, Call of Duty Mobile, and Genshin Impact use GPU resources for 60fps and higher frame-rate modes depending on smartphone display, thermal system, and game optimisation.

MediaTek Dimensity 8100 is manufactured on TSMC 5nm technology with the MT6895Z platform launched in March 2022. Qualcomm Snapdragon 870 uses TSMC 7nm technology with the SM8250-AC platform launched in January 2021. The 5nm and 7nm fabrication processes define transistor density, thermal characteristics, and power behaviour during workloads such as gaming, video recording, and 5G data usage.

MediaTek Dimensity 8100 records AnTuTu 10 scores around ~850,000 with Geekbench 6 results around ~1,270 single-core and ~4,100 multi-core. Qualcomm Snapdragon 870 listings show AnTuTu 9 scores around ~700,000 with Geekbench 5 results around ~1,000 single-core and ~3,400 multi-core. The benchmark versions differ because Snapdragon 870 launched before current benchmark databases became widely used.

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