MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888

MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888

Explore the MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888 comparison, covering specifications, performance, and features. Get Easy EMIs on the latest phones from Bajaj Finance.

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In summary

  • MediaTek Dimensity 8020 uses a 6nm TSMC process with 8 ARM cores, including 4x Cortex-A78@2.6GHz and 4x Cortex-A55@2.0GHz, while Qualcomm Snapdragon 888 uses Samsung 5nm with 8 cores including 1x Cortex-X1@2.84GHz, 3x Cortex-A78@2.42GHz and 4x Cortex-A55@1.8GHz.
  • MediaTek Dimensity 8020 integrates Mali-G610 MC6 GPU with Vulkan 1.3 support, while Qualcomm Snapdragon 888 integrates Adreno 660 GPU with Vulkan 1.1 support and hardware acceleration for 8K30 video workloads.
  • MediaTek Dimensity 8020 supports LPDDR5 memory at up to 3,200Mbps and UFS 3.1 storage, while Qualcomm Snapdragon 888 supports LPDDR5 memory at up to 3,200Mbps and UFS 3.1 storage.
  • MediaTek Dimensity 8020 uses the MediaTek Imagiq 780 ISP with 200MP camera support, while Qualcomm Snapdragon 888 uses Spectra 580 ISP with 200MP photo capture and 8K30 video recording.

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MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888– Overview

MediaTek Dimensity 8020 and Qualcomm Snapdragon 888 represent 5G smartphone chipsets from 2023 and 2020 respectively. MediaTek Dimensity 8020 uses TSMC 6nm fabrication, 4x Cortex-A78@2.6GHz + 4x Cortex-A55@2.0GHz CPU cores, Mali-G610 MC6 GPU, LPDDR5 memory and a 5G modem supporting up to 4.7Gbps download speeds. Qualcomm Snapdragon 888 uses Samsung 5nm fabrication, 1x Cortex-X1@2.84GHz + 3x Cortex-A78@2.42GHz + 4x Cortex-A55@1.8GHz CPU cores, Adreno 660 GPU, LPDDR5 memory and Snapdragon X60 5G modem supporting up to 7.5Gbps download speeds.
 

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Technical specifications - MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888

The MediaTek Dimensity 8020 and Qualcomm Snapdragon 888 processors are designed for different market segments, with the Dimensity 8020 catering to mid-range devices and the Snapdragon 888 aiming at flagship smartphones. Both were announced at different times, reflecting their respective brand strategies and technological advancements.


General

MediaTek Dimensity 8020 launched in March 2023 for upper-mid-range 5G smartphones, while Qualcomm Snapdragon 888 launched in December 2020 for flagship 5G devices. Dimensity 8020 uses TSMC 6nm manufacturing, whereas Snapdragon 888 uses Samsung 5nm fabrication with Snapdragon X60 modem integration.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
Launch dateMarch 2023December 2020
ManufacturerMediaTekQualcomm
Model numberMT6891Z/CZASM8350
Target segmentUpper-mid-range 5GFlagship 5G
Network support5G5G
Manufacturing process6nm5nm
FoundryTSMCSamsung

CPU

MediaTek Dimensity 8020 CPU uses 8 ARMv8-A cores with 4x Cortex-A78@2.6GHz performance cores and 4x Cortex-A55@2.0GHz efficiency cores. Qualcomm Snapdragon 888 uses 8 ARMv8 cores with 1x Cortex-X1@2.84GHz, 3x Cortex-A78@2.42GHz and 4x Cortex-A55@1.8GHz cores.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
CPU architectureARMv8-AARMv8-A
Core configuration4x Cortex-A78@2.6GHz + 4x Cortex-A55@2.0GHz1x Cortex-X1@2.84GHz + 3x Cortex-A78@2.42GHz + 4x Cortex-A55@1.8GHz
Total cores8 cores8 cores
Maximum clock speed2.6GHz2.84GHz
Instruction set64-bit ARM64-bit ARM
Process node6nm5nm
64-bit supportYesYes

Graphics

MediaTek Dimensity 8020 integrates Mali-G610 MC6 GPU based on Arm Valhall architecture with Vulkan 1.3 support, while Qualcomm Snapdragon 888 uses Adreno 660 GPU based on Qualcomm architecture with Vulkan 1.1 support. Both GPUs support high-refresh-rate smartphone gaming workloads at resolutions up to 1440p depending on device configuration.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
GPU modelMali-G610 MC6Adreno 660
GPU architectureArm ValhallQualcomm Adreno architecture
GPU API supportVulkan 1.3, OpenGL ES 3.2Vulkan 1.1, OpenGL ES 3.2
Gaming resolution supportUp to 1440pUp to 1440p
Display gaming scenarios120Hz/144Hz smartphone displays120Hz smartphone displays
Hardware video accelerationH.264, H.265, VP9H.264, H.265, VP9, AV1 decode
AI graphics featuresMediaTek HyperEngine 6.0 gaming optimisationQualcomm Game Quick Touch and Variable Rate Shading

Memory

MediaTek Dimensity 8020 and Qualcomm Snapdragon 888 both support LPDDR5 memory configurations with up to 3,200Mbps data rates and UFS 3.1 storage support. Dimensity 8020 uses a 64-bit memory bus design, while Snapdragon 888 integrates Qualcomm Hexagon architecture and memory optimisation for workloads including AI processing, 4K video editing and multitasking.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
Memory typeLPDDR5LPDDR5
Maximum memory frequency3,200Mbps3,200Mbps
Memory bus width64-bit64-bit
Maximum theoretical bandwidth~25.6GB/s~25.6GB/s
Maximum RAM support12GB16GB
Storage supportUFS 3.1UFS 3.1
ECC memory supportSupportedSupported

Multimedia (ISP)

MediaTek Dimensity 8020 uses MediaTek Imagiq 780 ISP with support for up to 200MP camera sensors, 4K60 HDR10+ video recording and 2520 x 1080 pixel display resolution support. Qualcomm Snapdragon 888 uses Spectra 580 ISP with triple 14-bit processing, 200MP camera support, 8K30 video recording and 4K120 slow-motion capture.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
ISP nameMediaTek Imagiq 780Qualcomm Spectra 580
ISP generationImagiq 780Spectra 580
Supported storage typeUFS 3.1UFS 3.1
Maximum display resolution2520 x 1080 pixel3840 x 2160 pixel
Maximum refresh rate support120Hz144Hz
Maximum camera resolution200MP200MP
Multi-camera supportTriple camera processingTriple camera processing
Video capture capability4K60 HDR10+8K30, 4K120
Video playback codecsH.264, H.265, VP9H.264, H.265, VP9, AV1
Audio codecsAAC, AIFF, FLAC, MP3AAC, AIFF, FLAC, MP3

Connectivity and network

MediaTek Dimensity 8020 integrates a 5G modem with 4.7Gbps peak download speed, while Qualcomm Snapdragon 888 integrates Snapdragon X60 5G Modem-RF system with up to 7.5Gbps download and 3Gbps upload speeds. Both chipsets support Wi-Fi 6 connectivity, Bluetooth 5.2 and multi-system GNSS positioning for smartphone navigation.

SpecificationMediaTek Dimensity 8020Qualcomm Snapdragon 888
Cellular modemIntegrated 5G modemSnapdragon X60 5G Modem-RF
Network support5G Sub-6GHz, 4G LTE5G Sub-6GHz, mmWave, 4G LTE
Maximum download speed4.7Gbps7.5Gbps
Maximum upload speed2.5Gbps3Gbps
Wi-Fi standardWi-Fi 6 (802.11ax)Wi-Fi 6 (802.11ax)
Bluetooth versionBluetooth 5.2Bluetooth 5.2
GNSS supportGPS, GLONASS, BeiDou, Galileo, NavICGPS, GLONASS, BeiDou, Galileo, QZSS, NavIC

MediaTek Dimensity 8020 vs Qualcomm Snapdragon 888 - Benchmarking

MediaTek Dimensity 8020 and Qualcomm Snapdragon 888 benchmark values reflect CPU architecture, GPU design, memory bandwidth and system workloads from different chipset generations. Dimensity 8020 uses Cortex-A78@2.6GHz cores and Mali-G610 MC6 graphics, while Snapdragon 888 uses Cortex-X1@2.84GHz, Cortex-A78@2.42GHz cores and Adreno 660 graphics. Benchmark values vary across smartphone models, RAM configurations and thermal systems.

Benchmark parameterMediaTek Dimensity 8020 scoreQualcomm Snapdragon 888 score
AnTuTu 10 total score~820,000~950,000
Geekbench 6 single-core~1,190~1,540
Geekbench 6 multi-core~3,850~3,720
3DMark Sling Shot Extreme overall~8,000~8,900

AnTuTu 10

AnTuTu 10 combines CPU, GPU, memory and UX workloads into a single smartphone performance score. MediaTek Dimensity 8020 listings record ~820,000 points, while Qualcomm Snapdragon 888 listings record ~950,000 points. The difference reflects Cortex-X1@2.84GHz performance cores, Adreno 660 graphics and memory subsystem tuning during gaming, app loading and multitasking workloads.

ComponentMediaTek Dimensity 8020Qualcomm Snapdragon 888
CPU~205,000~240,000
GPU~220,000~320,000
Memory~150,000~170,000
UX~245,000~220,000
Total score~820,000~950,000

Geekbench 6

Geekbench 6 measures CPU workloads including web browsing, image processing, multitasking and on-device machine learning tasks. MediaTek Dimensity 8020 with 4x Cortex-A78@2.6GHz and Qualcomm Snapdragon 888 with Cortex-X1@2.84GHz show different CPU configurations in single-core and multi-core testing.

BenchmarkMediaTek Dimensity 8020Qualcomm Snapdragon 888
Single-core~1,190~1,540
Multi-core~3,850~3,720

3DMark

3DMark evaluates sustained GPU workloads, graphics stability and thermal behaviour through repeated rendering tests. MediaTek Dimensity 8020 Mali-G610 MC6 GPU and Qualcomm Snapdragon 888 Adreno 660 GPU show different graphics architectures for workloads such as 1440p gaming, HDR rendering and extended gaming sessions.

ComponentMediaTek Dimensity 8020Qualcomm Snapdragon 888
Sling Shot Extreme – Graphics~8,400~9,300
Sling Shot Extreme – Physics~6,100~7,200
Overall score~8,000~8,900
Stability (%)~98%~92%

Disclaimer: Benchmark scores are approximate and may vary depending on the smartphone model, RAM configuration, software version, and cooling system.

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