When comparing the MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 4G, it is essential to consider the distinct strengths each chipset brings to the table. The MediaTek Dimensity 7050, launched in early 2024, is a high-end processor that offers robust performance and power efficiency, ideal for a variety of applications, from everyday tasks to more demanding activities like gaming and multimedia consumption. Its 8-core CPU architecture, built on a 6nm process, ensures a balance between performance and power consumption, making it a competitive choice in the high-performance segment. Additionally, its Mali-G77 MC9 GPU supports advanced graphics rendering, providing a smooth visual experience in gaming and other graphics-intensive applications.
On the other hand, the Qualcomm Snapdragon 888 4G, a flagship chipset released in late 2020, is known for its exceptional performance and cutting-edge features. Built on a 5nm process, it boasts a unique tri-cluster architecture with a powerful Cortex-X1 core, three Cortex-A78 cores, and four Cortex-A55 cores, delivering unmatched performance for both single-core and multi-core tasks. The Adreno 660 GPU within the Snapdragon 888 4G ensures top-tier gaming performance, making it a popular choice for
best gaming mobile phones. Furthermore, the Snapdragon 888 4G supports advanced connectivity features, including Wi-Fi 6E and Bluetooth 5.2, enhancing overall device connectivity and user experience. For those interested in exploring phones powered by MediaTek processors, a range of options can be found among
MediaTek processor phones, offering competitive performance and value across different price segments.
Technical specifications - MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 4G
General info
Both the MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 4G are high-performance chipsets announced by their respective manufacturers for use in mobile devices. These chipsets are designed to offer robust performance, advanced connectivity features, and efficient power consumption for modern smartphones and tablets.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Announced | 01 March 2024 | 28 December 2020 |
| Class | High-end | Flagship |
| Model number | MT7050 | SM8350 |
| Brand | MediaTek | Qualcomm |
CPU
The CPU architecture of the MediaTek Dimensity 7050 and Qualcomm Snapdragon 888 4G emphasises a balance between performance and efficiency. These CPUs are designed with multiple cores that cater to both high-performance tasks and energy-efficient operations, making them suitable for a variety of mobile applications.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Architecture | Arm Cortex-A78 | Arm Cortex-X1 & A78 |
| Cores | 8 (4x Cortex-A78, 4x Cortex-A55) | 8 (1x Cortex-X1, 3x Cortex-A78, 4x Cortex-A55) |
| Frequency | Up to 2.6 GHz | Up to 2.84 GHz |
| Instruction set | ARMv8.2-A | ARMv8.4-A |
| Process | 6nm | 5nm |
| TDP (Sustained power limit) | 6W | 10W |
| Manufacturing | TSMC | Samsung |
Graphics
Graphics capabilities in these chipsets are crucial for gaming, multimedia, and UI rendering. The GPUs integrated within these SoCs support advanced graphics features and ensure smooth visual experiences, from high-resolution gaming to video playback and user interface animations.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| SoC | Dimensity 7050 | Snapdragon 888 4G |
| GPU name | Mali-G77 MC9 | Adreno 660 |
| Architecture | Valhall | Adreno |
| GPU frequency | 900 MHz | 840 MHz |
| Execution units | 9 | - |
| Shading units | 72 | - |
| Total shaders | 72 | 512 |
| FLOPS | 2.5 TFLOPS | 26.4 TFLOPS |
| Vulkan version | 1.1 | 1.1 |
| OpenCL version | 2.0 | 2.0 |
| DirectX version | 12 | 12 |
Memory
Memory support is a critical aspect of these chipsets, affecting overall system performance, multitasking capabilities, and application responsiveness. Both chipsets support modern memory technologies, ensuring high-speed data access and efficient operation.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Memory type | LPDDR4x | LPDDR5 |
| Memory frequency | 2133 MHz | 3200 MHz |
| Bus | 4x16-bit | 4x16-bit |
| Max bandwidth | 34.1 GB/s | 51.2 GB/s |
| Max size | 16GB | 16GB |
Multimedia (ISP)
Multimedia capabilities encompass image and video processing, crucial for capturing high-quality photos and videos. These chipsets integrate advanced ISP features to support high-resolution cameras and efficient video encoding/decoding.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Storage type | UFS 3.1 | UFS 3.1 |
| Max display resolution | 2520 x 1080 | 3840 x 2160 |
| Max camera resolution | 108 MP | 200 MP |
| Video capture | 4K at 60 FPS | 8K at 30 FPS |
| Video playback | 4K at 60 FPS | 8K at 30 FPS |
| Video codecs | H.264, H.265, VP9 | H.264, H.265, VP9, AV1 |
| Audio codecs | AAC, LDAC, MP3 | AAC, aptX, MP3 |
Connectivity and network
Connectivity features determine the network capabilities and supported technologies for wireless communication. These chipsets offer advanced connectivity options, including support for the latest cellular networks, Wi-Fi standards, and other wireless technologies.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Modem | Integrated 5G | X60 4G LTE modem |
| 4G support | Yes | Yes |
| 5G support | Yes | No |
| Download speed | Up to 4.7 Gbps | Up to 3 Gbps |
| Upload speed | Up to 2.5 Gbps | Up to 316 Mbps |
| Wi-Fi | Wi-Fi 6 | Wi-Fi 6E |
| Bluetooth | 5.2 | 5.2 |
| Navigation | GPS, GLONASS, Beidou, Galileo | GPS, GLONASS, Beidou, Galileo |
MediaTek Dimensity 7050 vs Qualcomm Snapdragon 888 4G - Benchmarking
Benchmarks provide a comparative analysis of the performance of these chipsets under various computational and graphical workloads. The results offer insights into their efficiency and capability in real-world applications.
AnTuTu 10
AnTuTu is a popular benchmark that measures overall performance, including CPU, GPU, memory, and UX. These scores help to evaluate how these chipsets handle everyday tasks and high-demand applications.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| CPU | 210,000 | 250,000 |
| GPU | 300,000 | 320,000 |
| Memory | 130,000 | 150,000 |
| UX | 100,000 | 120,000 |
| Total score | 740,000 | 840,000 |
GeekBench 6
GeekBench tests the performance of chipsets in various real-world scenarios, focusing on single-core and multi-core operations. It evaluates aspects like compression, browsing, rendering, image processing, and more.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Asset compression | 5,500 | 6,200 |
| HTML 5 browse | 5,200 | 6,000 |
| PDF render | 6,000 | 7,000 |
| Image detection | 4,800 | 5,600 |
| HDR | 5,700 | 6,300 |
| Background blur | 5,400 | 6,100 |
| Photo processing | 5,600 | 6,200 |
| Ray tracing | 4,500 | 5,300 |
3DMark
3DMark is a benchmarking tool that evaluates the graphical performance of chipsets, focusing on stability, graphics tests, and overall score. It is widely used to assess the gaming and graphical rendering capabilities of mobile devices.
| Specification | MediaTek Dimensity 7050 | Qualcomm Snapdragon 888 4G |
| Stability | 98% | 95% |
| Graphics test | 6,500 | 7,200 |
| Score | 6,800 | 7,500 |
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